Advantages

Significantly improved flexural modulus, better tensile strength, notched impact strength, mould shrinkage, surface hardness and linear expansion compared with unmodified silicone.
Disadvantages

Lower elongation at break, HDT; reduced electrical characteristics and flow compared with unmodified silicone.
Typical Properties

Property


Value

Density (g/cm3)


1.85

Surface Hardness


RM90

Tensile Strength (MPa)


35

Flexural Modulus (GPa)


14

Notched Izod (kJ/m)


0.05

Linear Expansion (/°C x 10-5)


4

Elongation at Break (%)


1.5

Strain at Yield (%)


N/A

Max. Operating Temp. (°C)


240

Water Absorption (%)


0.1

Oxygen Index (%)


40

Flammability UL94


V0

Volume Resistivity (log ohm.cm)


14

Dielectric Strength (MV/m)


15

Dissipation Factor1kHz


0.002

Dielectric Constant 1kHz


3.9

HDT @ 0.45 MPa (°C)


260+

HDT @ 1.80 MPa (°C)


260

Material Drying hrs @ °C


NA

Melting Temp. Range (°C)


60 - 80

Mould Shrinkage (%)


0.3

Mould Temp. Range (°C)


180 - 210

Applications

Encapsulation of electronic components. High performance PCBs.